Metal Package
We supply more than 7 series, 500 varieties packages, the annual production capacity is more than 1 million sets.
Application
Fiber Optoelectronic Devices, Laser Devices, Hybrid Integrated Circuits, Semiconductor Circuits, Microwave Circuits, Infrared Detectors, etc.
Feature
1. Package material: Steel, Copper, Stainless steel, Kovar, AlSiC and various metals.
2. Leak proofness<1x10-9atm.cm3/s
3. Salt spray resistance: up to 48 hours (partially)
4. Plating material: Au, Sn, Ni etc
5. Glass-metal and ceramic-metal seal
6. High density, high strength, excellent heat dissipation
Material for Package cap and lead |
Kovar (4J29), CRS, OFHC, Tungsten copper, Iron-nickel alloy (4J42), 316L, 304L, AlSiC, etc. |
Package cap material |
Kovar (4J29), Iron-nickel alloy (4J42), etc. |
Package lead material |
Kovar (4J29), 4J50, Copper-core alloy, etc. |
(All the packages can be developed per customers¡¯ requirement) |
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