LTCC substrate & package
Our manufacturer is a leading supplier of LTCC products in the world.
Products include microwave & millimeter-wave modules, digital & analog module and passive integrated components. Typical products include T/R modules, SDC/RDC converters, filters, power-dividers, and various microwave multi-layer substrate.
Application
1. Base Station Amplifier Modules
2. Bluetooth and Wifi
3. Transmitters and Receivers
4. Power Splitters and Combiners
5. Handset Power Amplifiers
6. Low Noise Amplifiers
7. Mixers
8. Filters
9.
Feature
1. High circuit density, wide operating temperature
2. Low loss at high frequency
3. Low cost, high volume, fully integrated manufacturing processes
4. Multiple component modules
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Substrates and Tapes |
Range of LTCC tape materials from air leading suppliers, manufacturers-Dupont, ESL, Hereaus |
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Conductors |
Silver, Gold, Palladium Silver and Platinum Silver/Gold, Copper
Track width: Standard=3Mils, High Density=2-4Mils
Space: Standard=200-250Sm, High Density=100-125mm |
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Resistors, Capacitors, Inductors |
Infinite range of Values with Sheet resistivities from 10 Ohms-1M Ohms for surface resistors, 10 Ohm-10k Ohm for embedded resistors.
Resistors: Values and surface tolerance: +/- 1-2%
Embedded tolerance: +/-30%
Capacitors: x7R dielectric: up to 3000pF +/-20%
NPO dielectric: up to 200pF +/-10% |
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Vias |
Vias can be stacked, staggered, buried or blind. Hermeticity assured.
Dielectric Vias: Standard=6-10Mils, High Density=4-6Mils
Vias Pitch: Standard=3 x via size, High Density=2-2.5 x via size |
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Wire bonding |
Gold or Aluminum, Wedge or Ball, 18 to 500 microns diameter wire |
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