Series£ºST0801
Features
Low-temperature fast-curing
Thermal conductivity of Silanex is over 20 times than that of ordinary paste
Low volume resistivity, good electrical characteristics
High adhesive strength
Can be directly used for ceramics, aluminum, copper substrate thermal conductivity
Environmentally-friendly halogen-free
Applications
LED lamps and LED lighting modules
LED backlight module
CPU Thermal Module
Power Supply Module
Precision PCBA / FPCBA production
Flexible solar panels
IC Bonding, etc
ypical Physical Properties
Item ST0801
Appearance Brown
Thermal conductivity (at 25¡æ) 20 W/m.K
Volume resistivity(Thickness10¦Ìm) 4X10-4¦¸/cm2
Curing conditions 120¡æ/20min or 150¡æ/10min
Shelf life(Below10¡æ) 3 months
Series: ST0802 & ST0815
Features
Low-temperature fast-curing
Volume resistivity of ordinary Silver paste 1/20
Thermal conductivity of our product is over 20 times and 60 times than that of ordinary paste
High adhesive strength
Environmentally-friendly halogen-free
Applications
LED chip solid crystal
High-power IC device
Ceramic capacitors, resistors
Touch Screen
Car devices
Membrane switch
Flexible solar panels, etc.
Typical Physical Properties | |
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Item |
ST0801 |
| Appearance |
Brown |
| Thermal conductivity (at 25¡æ) |
20 W/m.K |
| Volume resistivity(Thickness10¦Ìm) |
4X10-4¦¸/cm2 |
| Curing conditions |
120¡æ/20min or 150¡æ/10min |
| Shelf life(Below10¡æ) |
3 months | |
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Die Shear Strength |
For a die 0.025in. square:
5.6kg at 25¡ãC initial value
5.8kg at 25¡ãC after 1000 hr. at 150¡ãC |
For a die 0.025in. square:
5.6kg at 25¡ãC initial value
5.8kg at 25¡ãC after 1000 hr. at 150¡ãC |
|
Coefficient of Linear |
Below Tg |
56.54ppm/¡æ |
56.54ppm/¡æ |
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Above Tg |
251.38ppm/¡æ |
251.38ppm/¡æ |
|
Shelf life (Below10¡æ) |
3months |
3months | | | |
